ONG, M. MICROELECTRONICS THERMAL DISSIPATION CHARACTERIZATION USING TRIZ. Journal of Advanced Manufacturing Technology (JAMT), [S. l.], v. 10, n. 1, p. 83–94, 2016. Disponível em: https://ojsdemo.utem.edu.my/jamt/article/view/597. Acesso em: 7 jul. 2025.