WONG, K.; LIEW, P.; LAU, K.; WANG, J. OPTIMIZATION OF COPPER VIA FILLING PROCESS FOR FLEXIBLE PRINTED CIRCUIT USING RESPONSE SURFACE METHODOLOGY. Journal of Advanced Manufacturing Technology (JAMT), [S. l.], v. 14, n. 2, 2020. Disponível em: https://ojsdemo.utem.edu.my/jamt/article/view/5935. Acesso em: 6 jul. 2025.