KANAN, M.; ZAIMI, M.; MANAF, M.; PHAM, N. Quality and Yield Improvement of Barrel Tin Plating Process for SMX Semiconductor Packages. Journal of Advanced Manufacturing Technology (JAMT), [S. l.], v. 12, n. 1(2), p. 79–90, 2018. Disponível em: https://ojsdemo.utem.edu.my/jamt/article/view/4271. Acesso em: 6 jul. 2025.