CHE ANI, F.; JALAR, A.; ISMAIL, R.; MUSTAFA, Z.; SAAD, A.; KHOR, C.; OTHMAN, N. K.; TURA ALI, M.; FATAH, M.; MUKHTAR, M.; ABAS, A. TIO2 Nanoparticles Reinforced Lead-Free 96.5Sn–3.0Ag–0.5Cu Solder Paste for Ultra-Fine Package Assembly in Reflow Soldering Process. Journal of Advanced Manufacturing Technology (JAMT), [S. l.], v. 12, n. 1(2), p. 413–424, 2018. Disponível em: https://ojsdemo.utem.edu.my/jamt/article/view/4296. Acesso em: 6 jul. 2025.