ABD RAHMAN, M.; AHMAD, A.; HASHIM, Z.; MUHAMAD, M.; BUDI, E. IMPACT OF TaN/Ta BILAYER ON THE BULK RESISTIVITY OF COPPER LAYER AT VARIOUS SELF-ANNEALING TIME. Journal of Advanced Manufacturing Technology (JAMT), [S. l.], v. 13, n. 3, 2019. Disponível em: https://ojsdemo.utem.edu.my/jamt/article/view/5738. Acesso em: 6 jul. 2025.