Kanan, M.M.D., M. Zaimi, M.E.A. Manaf, and N.M. Pham. “Quality and Yield Improvement of Barrel Tin Plating Process for SMX Semiconductor Packages”. Journal of Advanced Manufacturing Technology (JAMT) 12, no. 1(2) (August 27, 2018): 79–90. Accessed July 6, 2025. https://ojsdemo.utem.edu.my/jamt/article/view/4271.